Henkel LOCTITE® Hysol® EA 9396™ Low Viscosity Wet Lay-Up Paste
Henkel Hysol® EA 9396™ Low Viscosity Wet Lay-Up Paste from SkyGeek is specially formulated to deliver a better hold at virtually any temperature. The paste works in temperatures ranging from -67°F (-55°C) to 350°F (177°C), making it the ideal choice for any environment. The durable paste consists of two parts that must be thoroughly mixed prior to applying. The bonding paste can be used in dry or wet environments with excellent results. The two-part curing adhesive system boasts a one-year shelf life when stored at 77°F (25°C).
Henkel EA9396™ Low Viscosity Wet Lay-Up Paste from SkyGeek is available in a variety of sizes to suit your needs. Order a 50-gram, 1-pint or 1-quart container to deliver just the right amount of product for your specific application. Once mixed, the product has a handling time of approximately 75 to 90 minutes. It cures over the course of three to five days with accelerated curing in as little as an hour. The paste becomes strong enough to handle gently in just 24 hours of air curing. Please see EA9396™ mix instructions for more information about mixing and curing.
Hysol EA 9396 HandlingMixing - This product requires mixing two components together just prior to application to the parts to be
bonded. Complete mixing is necessary. The temperature of the separate components prior to mixing is not
critical, but should be close to room temperature (77°F/25°C).
Part A- 100 by Weight
Part B- 30 by Weight
Note: Volume measurement is not recommended for structural applications unless special precautions are taken to assure proper ratios.
Pot Life - (450 g mass) 75 - 90 minutes
Method - ASTM D2471 in water bath.
Mixing - Combine Part A and Part B in the correct ratio and mix thoroughly. THIS IS IMPORTANT!
Heat buildup during or after mixing is normal. Do not mix quantities greater than 450 grams as dangerous
heat buildup can occur causing uncontrolled decomposition of the mixed adhesive. TOXIC FUMES CAN OCCUR, RESULTING IN PERSONAL INJURY. Mixing smaller quantities will minimize the heat buildup.
Applying - Bonding surfaces should be clean, dry and properly prepared. For optimum surface preparation consult the Hysol Surface Preparation Guide. The bonded parts should be held in contact until the adhesive
is set. Handling strength for this adhesive will occur in 24 hours @ 77°F/25°C, after which the support tooling or pressure used during cure may be removed. Since full bond strength has not yet been attained,
load application should be small at this time.
Curing -This adhesive may be cured for 3 to 5 days @ 77°F/25°C to achieve normal performance.
Accelerated cures of 1 hour @ 150°F/66°C may be used.
Cleanup -It is important to remove excess adhesive from the work area and application equipment before it hardens. Denatured alcohol and many common industrial solvents are suitable for removing uncured
adhesive. Consult your supplier's information pertaining to the safe and proper use of solvents.
Features Low Viscosity
Room Temperature Cure
Room Temperature Storage
High Strength at Low and High Temperatures