Country of Origin
United States
Schedule B Code
3214.90.5000
Ship Dimensions
5 x 3 x 8 inches
HumiSeal 1B15 is a single component, fast drying, easily repaired, acrylic conformal coating intended for use on printed circuit assemblies.
Properties of Liquid HumiSeal Density, (g/cm3) per ASTM, Meth. D1475: 0.90 ± 0.02 Solids Content, % by weight per Fed-Std-141, Meth.4044: 35 ± 2 Viscosity, centipoise per Fed-Std--141, Meth. 4287: 470 ± 20 Flashpoint, 0C per ASTM, Meth. D56: -1 (30) VOC (grams / liter): 592 Drying Time to Handle per Fed-Std-141, Meth.4061: 10 minutes Recommended Curing Conditions: 24 hrs @ rm. temp or 30 min.@ 76°C (1700F) Time Required to Reach Optimum Properties: 7 days Pot Life at Room Temperature: 12 months Shelf Life at Room Temperature: 12 months Properties of Cured HumiSeal Thermal Properties
Continuous Use Operating Range°C): -65°C to +125°C Thermal Shock, per MIL-I-46058C: Passes Solderability: Good C oefficient of Thermal Expansion - DMA: 77ppm /°C Glass Transition Temperature - TMA: 15°C Young‘s Modulus - DMA: 10074psi Physical Properties
Clarity: Transparent Build per Dip, mils, per ASTM,Meth.D823: 2 Flexibility, per MIL-I-46058C: Fair Adhesion, per ASTM, Meth. D2197: Excellent Flammability, per ASTM, Meth. D635: Self-Extinguishing Weather Resistance: Very Good Electrical Properties
Dielectric Withstand Voltage, volts per MIL-I-46058C: >1,500 Dielectric Breakdown Voltage, volts, per ASTM, Meth. D149: 8000 Dielectric Constant, at 1MHz and 250C, per ASTM-D150-65T: 2.03 Dissipation Factor, at 1MHz and 250C, per ASTM-D150-65T: 0.01 Insulation Resistance, ohms, per MIL-I-46058C: 350 x 1012 Moisture Resistance, ohms, per MIL-I-46058C: 40 x 109 Chemical Properties
Main Constituent: Acrylic Fungus Resistance, per ASTM-G21: Passes Resistance to Chemicals: Fair
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