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Henkel Hysol EA9309.3NA Epoxy Paste Adhesive - 6 oz SemKit
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Henkel Hysol EA9309.3NA Epoxy Paste Adhesive - 6 oz SemKit

Part#: AS9354002
Our Price: $42.26
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Material Safety Information
Code: UN2735 | Class: 8 | Group: II - Details
Material Safety Data Sheet: MSDS1
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  • High Shear Strength
  • High Peel Strength
  • Bondline Thickness Control
  • Good Environmental Resistance
    Alternate PN#s: EA9309.3NA EA 9309.3NA
  • Adhesives > Structural > Metal and Honeycomb Assembly Adhesives > Structural: Composite Assembly > Bonding Films

    Mixing: This product requires mixing two components together just prior to application to the parts to be bonded. Complete mixing is necessary. The temperature of the separate components prior to mixing is not critical, but should be close to room temperature (77F/25C).

    Mix Ratio By Weight

      Part A: 100
      Part B: 22
    Note: Volume measurement is not recommended for structural applications unless special precautions are taken to assure proper ratios.

    Pot Life (450 gm mass): 35 minutes
    Method: ASTM D2471 in water bath


    Mixing: Combine Part A and Part B in the correct ratio and mix thoroughly. THIS IS IMPORTANT! Heat buildup during or after mixing is normal. Do not mix quantities greater than 450 grams as dangerous heat buildup can occur causing uncontrolled decomposition of the mixed adhesive. TOXIC FUMES CAN OCCUR, RESULTING IN PERSONAL INJURY. Mixing smaller quantities will minimize the heat buildup.

    Applying: Bonding surfaces should be clean, dry and properly prepared. For optimum surface preparation consult the Hysol Surface Preparation Guide. The bonded parts should be held in contact until the adhesive is set. Handling strength for this adhesive will occur in 12 hours @ 77F/25C, after which the support tooling or pressure used during cure may be removed. Since full bond strength has not yet been attained, load application should be small at this time.

    Curing: This adhesive may be cured for 3 to 5 days @ 77F/25C or 1 hour @ 180F/82C to achieve normal performance.

    Cleanup: It is important to remove excess adhesive from the work area and application equipment before it hardens. Denatured alcohol and many common industrial solvents are suitable for removing uncured adhesive. Consult your supplier's information pertaining to the safe and proper use of solvents.

    Product Details
    UOM : Cartridge
    Size : 6 oz
    Color Family : Pink
    Ship Dimensions : 10 x 3 x 3 inches
    Shipping Weight : 2 pounds
    Manufacturer P/N : AS9354002
    ECCN : EAR99
    Schedule B Code : 3907.30.0000
    Alt. P/Ns : EA9309.3NA EA 9309.3NA
    Disclaimer: While reasonable efforts have been made to ensure all information on this website is accurate, and Styles Logistics, Inc. do not assume responsibility for any errors or omissions. All specifications, illustrations, data and prices are subject to change without notice.
    Uncured Adhesive Properties Part A Part B
    Color Pink Blue
    Viscosity @ 77F 3,000 Poise 0.2 Poise
    Brookfield, HBT Spdl 7 @ 20 rpm Spdl 1 @ 60 rpm (LVF)
    Density 1.15 1.0
    Viscosity @ 25C 300 PaS 0.02 PaS
    Brookfield, HBT Spdl 7 @ 2.1 rad/s Spdl 1 @ 6.3 rad/s
    Warranty Life @ 77F 1 year 1 year

    Bond Strength Performance

    Tensile Lap Shear Strength
    Tensile lap shear strength tested per ASTM D1002 after curing for 5 days @ 77F/25C. Adherends are 2024-T3 alclad aluminum treated with phosphoric acid anodizing per ASTM D3933.

    Test Typical Results
    Tensile Lap Shear Strength
    -67/-55 (F/C)
    77/25 (F/C)
    180/82 (F/C)

    4,000/27.6 (psi/MPa)
    4,200/28.9 (psi/MPa)
    1,000/6.9 (psi/MPa)
    Tensile Lap Shear Strength
    Control, 77F/25C
    77F Water - 30 days
    120F/49C - 98% RH - 30 days
    Hydraulic Oil - 7 days
    JP-4 Fuel - 7 days
    Salt Spray - 105F/41C - 30 days
    Anti-icing Fluid - 7 days
    Hydrocarbon III - 7 days
    Skydrol 500 - 7 days
    Creep Deflection at 77F after 192 hrs @ 1600 psi load (11.0 Mpa)

    4,800/33.1 (psi/MPa)
    4,700/32.4 (psi/MPa)
    5,100/35.2 (psi/MPa)
    4,600/31.7 (psi/MPa)
    4,700/32.3 (psi/MPa)
    5,000/32.4 (psi/MPa)
    4,500/31.3 (psi/MPa)
    4,300/29.6 (psi/MPa)
    4,600/31.7 (psi/MPa)
    0.00056 in/0.0142 mm

    Peel Strength
    T-Peel strength tested per ASTM D1876 after curing for 3 to5 days @ 77F/25C. Adherends are 2024-T3 alclad aluminum treated with phosphoric acid anodizing per ASTM D3933.

    Test Temperature: 77F/25C
    Typical Results: 35 Lb/in, 156 N/25mm

    Service Temperature
    Service temperature is defined as that temperature at which this adhesive still retains 1000 psi/6.9 MPa using test method ASTM D1002 and is approximately 180F/82C.

    Dexter QC Acceptance Testing
    This data sheet provides users with typical properties obtained from this adhesive. These values are not meant to be used to develop aerospace QC acceptance testing. Users interested in establishing values and tests for routine QC acceptance should request the Dexter Aerospace Specification (DAS) which provides detail test methods and values used to certify this adhesive.

    Bulk Resin Properties

    Tensile Properties
    Tested using 0.125 inch/3.18 mm castings per ASTM D638.

    Bulk Resin Properties Typical Results
    Tensile Properties
    Tensile Strength @ 77F/25C
    Tensile Modulus @ 77F/25C
    Elongation at Break, % @ 77F/25C
    Shore D Hardness @ 77F/25C
    Shear Modulus
    Poissons Ratio
    4,500 psi/31.0 MPa
    324 ksi/2,232 MPa
    124 ksi/854 MPa
    Glass Transition Temperature (Cure 7 days @ 77F)
    Tg dry (77F/25C) (Tan delta by DMTA)
    Tg wet (Tan delta by DMTA)

    Compressive Properties (0.5 inch/12.7 mm castings, ASTM D695)
    Compressive Strength @ 77F/25C
    Compressive Modulus @ 77F/25C

    7,500 psi/51.7 MPa
    245 ksi/1,688 MPa
    Electrical Properties (ASTM D149, D150)
    Dielectric Constant
    Dissipation Factor
    Volume Resistivity (ohm-cm)
    Surface Resistivity (ohm)
    Thermal Conductivity (cal/sec-cm-C)

    4.33 (0.1 KHz)/4.29 (1.0 KHz)/4.17 (10.0 KHz)
    .018 (0.1 KHz)/.014 (1.0 KHz)/.028 (10.0 KHz)
    1.36 x 10^14 (0.1 KHz)
    4.94 x 10^14 (0.1 KHz)
    4.50 x 10-4 (0.1 KHz)
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